代表性研究成果
发表SCI论文50余篇，代表性论文如下：
[1] Y Gong, S Li, F Qin, B Xu. Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features, Engineering with Computers, 6 (2025) 4799-4824.
[2] Y Gong, Y Kou, Q Yue, X Zhuang, N Valizadeh, F Qin, Q Wang, T Rabczuk. A phase-field study on thermo-mechanical coupled damage evolution and failure mechanisms of sintered silver interconnections. Engineering Fracture Mechanics, 2025: 111039.
[3] Y Gong, Y He, H Hu, X Zhuang, F Qin, H Xu, T Rabczuk. A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures, Engineering Structures 326 (2025) 119500
[4] Y Gong, Y Kou, Q Yue, X Zhuang, F Qin, Q Wang, T Rabczuk. The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures, International Communications in Heat and Mass Transfer 159 (2024) 108033
[5] F Qin, Q He, Y Gong*, C Hou, H Cheng, T An, Y Dai, P Chen. An automatic finite element method-boundary element method coupling method for elastic–plastic problems of multiscale structures in electronic packaging, Journal of Electronic Packaging 145 (2) (2023) 021003
[6] F Wang*, Z Chen, Y Gong*. Local knot method for solving inverse Cauchy problems of Helmholtz equations on complicated two‐and three‐dimensional domains, International Journal for Numerical Methods in Engineering 123 (20) (2023) 4877-4892
[7] Y Gong*, F Qin, C Dong, J Trevelyan. An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources, Applied Mathematical Modelling 109 (2022) 161-185
[8] Y Gong, C. Dong, F. Qin, G. Hattori, J. Trevelyan. Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures, Computer Methods in Applied Mechanics and Engineering 367 (2020) 113099.
[9] Y Gong, J. Trevelyan, G. Hattori, C Dong. Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures, Computer Methods in Applied Mechanics and Engineering 346 (2019) 642-673.
[10] Y Gong, H Yang, C Dong. A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions, Computational Mechanics 63(2) (2019) 181-199.
[11] Y Gong, C Dong, X Qu. An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity, Advances in Engineering Software 119 (2018) 103-115.
